Each of the five winning projects - one in each of the five categories - will be produced and displayed in the Brand Experience Contest booth at The Dieline Package Design Conference in Chicago on June 22, 2011.
All five winners receive:
- International recognition on TheDieline.com
- Opportunity to accept a physical award during a presentation at The Dieline Package Design Conference, presented by HOW. Avery Dennison will provide conference registration for The Dieline Package Design Conference.
- Images of the winning projects and information about the designer who created them will be featured in a limited edition Look Book distributed to 2,000 global consumer packaging brand owners by Avery Dennison.
- Avery Dennison will make a $1,000 donation in the name of each of the five winners to one of several international charities, including:
About The Dieline Package Design Conference
The windy city is waiting for you. Join designers from across the country in Chicago for The Dieline Package Design Conference where the Avery Dennison Brand Experience Contest winners will be announced. This conference brings together the Package Design industry together under one roof. From package designers of all levels, to tastemakers, to top industry experts, all connecting and sharing their passion for package design. http://www.thedieline.com/conference
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